Chip Gallery

Cryogenic PDK for Quantum Computing,

Fully-Integrated LDO, PLL, 

TX with Crosstalk Cancellation, 

and more ... 

Please stay tuned :D 

Process: UMC 28 nm CMOS

Application: Mobile Display Link

Publication: 2025 TVLSI

Process: Samsung 28 nm CMOS

Application: VLSI/Memory Module

Publication: 2025 TVLSI

Process: TSMC 40 nm CMOS

Publication: 2022 A-SSCC, 2023 TPE

Process: TSMC 65 nm CMOS

Publication: 2022 JSSC

Process: Samsung 28 nm CMOS

Publication: 2020 ISSCC, 2022 JSSC

Process: UMC 80 nm HV CMOS

Publication: 2019 ESSCIRC

Process: TSMC 180 nm RF CMOS

Publication: 2019 JSSC, 2019 ISLPED

Process: TSMC 180 nm RF CMOS

Publication: 2018 CICC

Process: TSMC 180 nm GP CMOS 

Publication: 2016 ISSCC, 2019 JSSC

Process: TSMC 180 nm RF CMOS

Publication: 2018 TCAS-II, 2018 EL

Process: Samsung 28 nm CMOS

Publication: 2019 Access

Process: Samsung 28 nm CMOS

Publication: 2018 A-SSCC, 2022 TVLSI

Process: Magna/Hynix 180 nm CMOS

Publication: 2017 A-SSCC, 2023 TVLSI

Process: Samsung 65 nm LP CMOS

Publication: 2017 TCAS-II